Teledyne FLIR, part of Teledyne Technologies Incorporated, has announced the expansion of the Boson+ thermal camera module product line with 24 compact models featuring 320 x 256 resolution. Radiometry – the ability to take the temperature of every pixel – as well as both MIPI and CMOS interfaces are now also available on all resolutions.
According to the company, with these updates and a thermal sensitivity of 10 millikelvin (mK) or less, Boson+ is the most sensitive longwave infrared (LWIR) camera line in the market and is ideal for integration in unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), automotive, wearables, security applications, handhelds and thermal sights.
“Boson+ is a drop-in upgrade for systems designed with Boson, making upgrades low risk and plug-and-play simple,” said Dan Walker, Vice President, Product Management, OEM cores, Teledyne FLIR. “With customer-selectable USB, CMOS or MIPI video interfaces, it is now easier than ever to integrate Boson+ with a wide range of embedded processors from Qualcomm, Ambarella and more.”
Teledyne FLIR highlights that the Boson+ is made in the US and features 640 x 512 and now 320 x 256 resolutions utilizing the latest 12-micron pixel pitch thermal detector within a size, weight and power (SWaP) optimized package. The noise equivalent differential temperature (NEDT) of 20 mK or less offers enhanced detection, recognition and identification (DRI) performance, especially in low-contrast and low-visibility environments.
The company says that with improved automatic gain control (AGC) and video latency compared to previous iterations of Boson, the Boson+ delivers dramatically enhanced scene contrast and sharpness while improving tracking, seeker performance and decision support. Designed for integrators, the Boson+ is also available with a variety of lens options, comprehensive product documentation, an easy-to-use SDK and a user-friendly GUI.