Teledyne FLIR has upgraded the software on its Boson+ thermal camera module, designed to enhance uncooled thermal imaging for defense, firefighting, security and surveillance applications.

Featuring thermal sensitivity of ≤20 mK, Boson+ has been upgraded to provide improved thermal imagery and spatial filtering, according to the company.

Simplifying integration

“Boson+ shares the industry-leading size, weight and power (SWaP) of the widely deployed and real-world-proven Boson thermal camera module, simplifying integration and shortening time to market for our customers,” said Dan Walker, Vice President, Product Management, OEM cores, Teledyne FLIR.

“With software updates including new color palettes, low gain mode and an updated GUI, the AI-ready Boson+ continues to be the go-to thermal module for defense, industrial, and commercial integrators.”

Boson+ interfaces with the new Teledyne FLIR AVP, an advanced video processor that powers Prism AI and computational imaging at the edge.

The AVP, built on the latest Qualcomm QCS8550, runs Teledyne FLIR Prism AI software providing detection, classification and target tracking.

To improve data fidelity and enhance decision support, it also operates Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement and noise reduction.